Raytheon, an RTX business, has been awarded a $20 million contract to develop a next-generation multi-chip package for use in ground, maritime, and airborne sensors. The contract was awarded through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems consortium to develop a multi-chip package.
As per the contract, Raytheon will be collaborating with industry partners like AMD to integrate state-of-the-art commercial devices to create a compact microelectronics package. The package will be designed to convert radio frequency energy to digital information with more bandwidth and higher data rates, resulting in new system capabilities that offer higher performance, lower power consumption, and reduced weight.
“By teaming with commercial industry, we can incorporate cutting-edge technology into Department of Defense applications on a much faster timescale,” said Colin Whelan, president of Advanced Technology at Raytheon. “Together, we will deliver the first multi-chip package that features the latest in interconnect ability – which will provide new system capabilities to our warfighters.”
The multi-chip package being developed by Raytheon will be integrated with the latest industry-standard die-level interconnect ability. This will enable individual chiplets to achieve their peak performance and unlock new system capabilities in a cost-effective and high-performance way.
The package is also designed to be compatible with Raytheon’s scalable sensor processing requirements.
As part of the development process, chiplets from commercial partners will be integrated into a Raytheon-designed and fabricated interposer. This will be done using the 3D Universal Packaging (3DUP) domestic silicon manufacturing process, which is located in Lompoc, California.
The contract for this project will be managed by the National Security Technology Accelerator and administered by the Naval Surface Warfare Center Crane Division in Indiana.
